APPLIED MATERIALS MIRRA MESA Products

  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9104952
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2001 
    CMP system, 8" | System: Dry in / Dry out | Process: Cu | | Software | Polisher MB60a1 | Cleaner CB22p2 | Endpoint IB11h7 | CPU Pentium III 400MHz | Dual RAID HardDisk Yes | HardDisk Size 68GB | RAM 128MB | | Hardware | Polisher /with Controller Mirra 3400 / 5200 | Cleaner Mesa | Indexer Rorze FABS SMIF | # FOUP Install: (3) | Metrology None | Slurry(P1+P2+P3) ABCD Each | Endpoint Laser P1 iScan | Endpoint Laser P2 FullScan | Endpoint Laser P3 None | Polisher Middle Skins Opaque | Pad Conditioner type Universal | Platen Coating Teflon | UPA Standard | Chiller No | Com Port Server Digi EL160 | Cleaner Brush LDM Direct Feed LDM with entegris flow sensors | Walking Beam PEEK Fingers with PP Grippers | Slurry in CLC Yes | Slurry Arm 4line | Polishing Head Titan I | Rotary Union 4-port | Cross type Cattrack | UPA 3 Port | Megasonics yes | SRD Yes | Brush 1 yes | Brush 2 yes | | PM reduction kit | blackout covers | Splash guard | Exhaust blower | Magnehelic Pressure Low Level detection kit | SRD Exhaust Interlock | | 2001 vintage.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9104368
    Category:
    Wafer Grinding, Lap...
    CMP system.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9105123
    Category:
    Wafer Grinding, Lap...
    CMP system | Mirra: Cu process | Mesa: B1, B2 Direct feed | SMIF | Controller.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9063651
    Category:
    Wafer Grinding, Lap...
    CMP system.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9105019
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    System, 8".
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9027749
    Category:
    Spare Parts
    Titan Head, 8" | AS2000 integration | SiO2 | Gas: NH4OH, DHF | Slurry supply: FSI P2200 | 1999 vintage.
  • APPLIED MATERIALS: Mirra / AS 2000

    Details
    ID#:
    9093222
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2001 
    Cu CMP System, 8", 2001 vintage.
  • APPLIED MATERIALS: Mirra / AS 2000

    Details
    ID#:
    9093221
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2000 
    Cu CMP System, 8", 2000 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9100230
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    1999 
    CMP oxide system, 8" | Parts system | 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9086233
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    6" 
    CMP system, 6" | Missing parts.
  • APPLIED MATERIALS: Mirra OnTrak

    Details
    ID#:
    9105018
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    System, 8".
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9094905
    Category:
    Wafer Grinding, Lap...
    Vintage:
    1999 
    Polisher, 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9094903
    Category:
    Wafer Grinding, Lap...
    Vintage:
    1998 
    Polisher, 1998 vintage.
  • APPLIED MATERIALS: Mirra

    Details
    ID#:
    9077689
    Category:
    Wafer Grinding, Lap...
    Vintage:
    1999 
    CMP / Scrubber system, tungsten | 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9092916
    Category:
    Wafer Grinding, Lap...
    Vintage:
    2009 
    CMP Systems.
  • APPLIED MATERIALS: Mirra

    Details
    ID#:
    9077698
    Category:
    Wafer Grinding, Lap...
    Vintage:
    1999 
    CMP / Scrubber system | STI / HS slurry | 1999 vintage.
  • APPLIED MATERIALS: Mirra

    Details
    ID#:
    9077696
    Category:
    Wafer Grinding, Lap...
    Vintage:
    2000 
    CMP / Scrubber system, Cu | 2000 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9094166
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Polisher, 8" | Tungsten | AS-2000 scrubber.
  • APPLIED MATERIALS: Mirra Trak

    Details
    ID#:
    9075344
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    ILD (InterLayer Dielectric) CMP system, 8" | Oxide / Poly Silicon / STI.
  • APPLIED MATERIALS: Mirra Trak

    Details
    ID#:
    9096039
    Category:
    Wafer Grinding, Lap...
    Stand alone CMP system | Titan II Heads: s zone, Mem, RR, IT | DDF3 pad conditioners.
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