APPLIED MATERIALS MIRRA MESA Products

  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9093383
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Cleaner, 8" | Runs copper application.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9063651
    Category:
    Wafer Grinding, Lap...
    CMP system.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9093565
    Category:
    Wafer Grinding, Lap...
    Cleaner.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    116910
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    1999 
    CMP Oxide polishing system, 8" | Wafer shape: JMF | System: dry in / dry out | Process: all | Device: Flash | Device geometry: 0.09 microns | | Consumed process material | Polish slurry: Low selectivity, Silica | Buff slurry: Low selectivity, Silica | Platen 1 Pad: IC 1070 / IC 1010 | Platen 2 Pad: IC 1070 / IC 1010 | Platen 3 Pad: IC 1070 / IC 1010 | Pad conditioner: snap on | Pad conditioner head: DDF3 | Pad conditioner holder: magnetic snap on | | Factory interface options | Cleaner: Ontrak | Megasonic: N/A | Robot: 100" Single, dual plade | In situ removal rate monitor: Digital ISRM, not installed | In line metrology: none | SECS GEM Interface: Yes | Cassette tank: STD | Cassette type: none | Installation type: through the wall | Integrated system basic FABS: Fluroware A-200-81M | | Calibration tool | Down force cal: Yes | Head rebuild kit: no | RPM 3 cal kits: no | Fabs laptop computer: (1) OnTrak PC with teaching disk | | Platen and head options | Polishing head: (4) Titan I heads | Retaining ring: (4) PPS, AEP | Pad water loss sensor: Dual sensor with blower | Platen temperature control: none | | Slurry delivery options | Delivery: 2 Slurry | Flow rate: STD flow, NT flowmeter | Flow monitor: yes, NT flowmeter | Containment bulkhead: single containment | Facilities: none | Loop line: no | Dispense arm: STD extended rinse arm | Leak detector: no | DI water: Yes | High pressure rinse: Yes | | System software | Mirra Trak | Software: P558P0 | Cleaner type: OnTrak | Clean software: Ver 2.3.6 | Fab type: STD | Fab software: B3.08A | | Safety equipment | Red turn to release EMO | EMO guard ring | Earthquake brackets: no | LO To disconnect to polisher: no | Smoke detector: yes | UPS battery | Delta connection: yes | | Umbilicals | Polisher to controller cable: 75 ft | Controller to monitor cable: 75 ft | Slurry system interface cable: none | | Factory hook up | Upper exhaust: std | Lower exhaust: none | Upper exhaust connection: 8" | Drain manifold: 4 line to FAC | Drain adapter: NPT fitting | Casters for mirra system: no | Skid pad: yes | | User I/O | Grey area: (1) monitor | Cleanroom: (1) monitor | Class 1 cart | Stainless cart | PC Mouse | Printer: no | Hard disk backup: yes | | Polisher light tower | 4-lights: RYGB | | 200~230 V, 50/60 Hz, 200 A | 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    116913
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2004 
    CMP Oxide polishing system, 8" | Wafer shape: JMF | System: dry in / dry out | Process: all | Device: Flash | Device geometry: 0.09 microns | | Consumed process material | Polish slurry: Low selectivity, Silica | Buff slurry: Low selectivity, Silica | Platen 1 Pad: IC 1070 / IC 1010 | Platen 2 Pad: IC 1070 / IC 1010 | Platen 3 Pad: IC 1070 / IC 1010 | Pad conditioner: snap on | Pad conditioner head: DDF3 | Pad conditioner holder: magnetic snap on | | Factory interface options | Cleaner: Ontrak | Megasonic: N/A | Robot: 100" Single, dual plade | In situ removal rate monitor: Digital ISRM | In line metrology: none | SECS GEM Interface: Yes | Cassette tank: STD | Cassette type: none | Installation type: through the wall | Integrated system basic FABS: Fluroware A-200-81M | | Calibration tool | Down force cal: Yes | Head rebuild kit: no | RPM 3 cal kits: no | Fabs laptop computer: (1) OnTrak PC with teaching disk | | Platen and head options | Polishing head: (4) Titan I heads | Retaining ring: (4) PPS, AEP | Pad water loss sensor: Dual sensor with blower | Platen temperature control: none | | Slurry delivery options | Delivery: 2 Slurry | Flow rate: STD flow, NT flowmeter | Flow monitor: yes, NT flowmeter | Containment bulkhead: single containment | Facilities: none | Loop line: no | Dispense arm: STD extended rinse arm | Leak detector: no | DI water: Yes | High pressure rinse: Yes | | System software | Mirra Trak | Software: P558P0 | Cleaner type: OnTrak | Clean software: Ver 2.3.6 | Fab type: STD | Fab software: B3.08A | | Safety equipment | Red turn to release EMO | EMO guard ring | Earthquake brackets: no | LO To disconnect to polisher: no | Smoke detector: yes | UPS battery | Delta connection: yes | | Umbilicals | Polisher to controller cable: 75 ft | Controller to monitor cable: 75 ft | Slurry system interface cable: none | | Factory hook up | Upper exhaust: std | Lower exhaust: none | Upper exhaust connection: 8" | Drain manifold: 4 line to FAC | Drain adapter: NPT fitting | Casters for mirra system: no | Skid pad: yes | | User I/O | Grey area: (1) monitor | Cleanroom: (1) monitor | Class 1 cart | Stainless cart | PC Mouse | Printer: no | Hard disk backup: yes | | Polisher light tower | 4-lights: RYGB | | 200~230 V, 50/60 Hz, 200 A | 2004 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9054030
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    1998 
    CMP Oxide polishing system, 8" | Wafer shape: JMF | System: dry in / dry out | Process: all | Device: Flash | Device geometry: 0.09 microns | | Consumed process material | Polish slurry: Low selectivity, Silica | Buff slurry: Low selectivity, Silica | Platen 1 Pad: IC 1070 / IC 1010 | Platen 2 Pad: IC 1070 / IC 1010 | Platen 3 Pad: IC 1070 / IC 1010 | Pad conditioner: snap on | Pad conditioner head: DDF3 | Pad conditioner holder: magnetic snap on | | Factory interface options | Cleaner: Ontrak | Megasonic: N/A | Robot: 100" Single, dual plade | In situ removal rate monitor: Digital ISRM, not installed | In line metrology: none | SECS GEM Interface: Yes | Cassette tank: STD | Cassette type: none | Installation type: through the wall | Integrated system basic FABS: Fluroware A-200-81M | | Calibration tool | Down force cal: Yes | Head rebuild kit: no | RPM 3 cal kits: no | Fabs laptop computer: (1) OnTrak PC with teaching disk | | Platen and head options | Polishing head: (4) Titan I heads | Retaining ring: (4) PPS, AEP | Pad water loss sensor: Dual sensor with blower | Platen temperature control: none | | Slurry delivery options | Delivery: 2 Slurry | Flow rate: STD flow, NT flowmeter | Flow monitor: yes, NT flowmeter | Containment bulkhead: single containment | Facilities: none | Loop line: no | Dispense arm: STD extended rinse arm | Leak detector: no | DI water: Yes | High pressure rinse: Yes | | System software | Mirra Trak | Software: P558P0 | Cleaner type: OnTrak | Clean software: Ver 2.3.6 | Fab type: STD | Fab software: B3.08A | | Safety equipment | Red turn to release EMO | EMO guard ring | Earthquake brackets: no | LO To disconnect to polisher: no | Smoke detector: yes | UPS battery | Delta connection: yes | | Umbilicals | Polisher to controller cable: 75 ft | Controller to monitor cable: 75 ft | Slurry system interface cable: none | | Factory hook up | Upper exhaust: std | Lower exhaust: none | Upper exhaust connection: 8" | Drain manifold: 4 line to FAC | Drain adapter: NPT fitting | Casters for mirra system: no | Skid pad: yes | | User I/O | Grey area: (1) monitor | Cleanroom: (1) monitor | Class 1 cart | Stainless cart | PC Mouse | Printer: no | Hard disk backup: yes | | Polisher light tower | 4-lights: RYGB | | 200~230 V, 50/60 Hz, 200 A | 1998 vintage.
  • APPLIED MATERIALS: Mirra

    Details
    ID#:
    189976
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    1998 
    ILD (InterLayer Dielectric) CMP system, 8" | Oxide / Poly Silicon / STI | 1998 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9012574
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    6" - 8" 
    Vintage:
    1999 
    CMP system, 6" - 8" | Stand-alone | 1999 vintage.
  • APPLIED MATERIALS: Mirra OnTrak

    Details
    ID#:
    9088326
    Category:
    Wafer Grinding, Lap...
    Oxide CMP Systems, 8".
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9081680
    Category:
    Wafer Grinding, Lap...
    CMP systems, 8".
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9086233
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    6" 
    CMP system, 6" | Missing parts.
  • APPLIED MATERIALS: Mirra OnTrak

    Details
    ID#:
    9050390
    Category:
    Wafer Grinding, Lap...
    CMP System, 12".
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9094166
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Polisher, 8" | Tungsten | AS-2000 scrubber.
  • APPLIED MATERIALS: Mirra OnTrak

    Details
    ID#:
    9064388
    Category:
    Wafer Grinding, Lap...
    Oxide CMP System, 8" | 1999 vintage.
  • APPLIED MATERIALS: Mirra OnTrak

    Details
    ID#:
    9064387
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    1997 
    Oxide CMP System, 8" | 1997 vintage.
  • APPLIED MATERIALS: Mirra Titan I

    Details
    ID#:
    185104
    Category:
    Spare Parts
    Carriers.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9088291
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    6" 
    Vintage:
    1997 
    CMP system, 6" | Missing: Hard disk | 1997 vintage.
  • APPLIED MATERIALS: Mirra CMP 5201

    Details
    ID#:
    9092916
    Category:
    Wafer Grinding, Lap...
    Vintage:
    2009 
    CMP System, 2009 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9027740
    Category:
    Wafer Grinding, Lap...
    CMP polishing system, 8" | AS-2000 integration | Mirra Mainframe with ISRM | Titan head | AS-2000 Dry-in/dry-out cleaner with DBC-TBC-DTC | FABS (configuration available) | Currently installed in a cleanroom | 2000 vintage.
  • APPLIED MATERIALS: Mirra

    Details
    ID#:
    9077689
    Category:
    Wafer Grinding, Lap...
    Vintage:
    1999 
    CMP / Scrubber system, tungsten | 1999 vintage.
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