APPLIED MATERIALS MIRRA MESA Products

  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9075137
    Category:
    Wafer Grinding, Lap...
    CMP system | Oxide | De-installed | 2004 vintage.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9071745
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2003 
    CMP System, 8" | Polisher: Mirra 3400 | Controller: 5200 | Cleaner: Mesa | Indexer: Rorze FABS | FOUP's Installed: 3 | Metrology: None | Slurry(P1+P2+P3): ABCD each | Endpoint Laser P1: IScan | Endpoint Laser P2: FullScan | Endpoint Laser P3: None | Polisher Middle Skins: Opaque | UPA: Standard | Chiller: No | Com Port Server: Digi EL160 | Cleaner Brush LDM: User-Modified direct feed LDM with entegris flow sensors | Walking Beam: PEEK Fingers with PP Grippers | Slurry in CLC: Yes | Slurry Arm: 4-line | Polishing Head: Titan I | Rotary Union: 4-port | Cross type: Cattrack | Platen Teflon Coated: Yes | Pad Conditioner Type: Universal | Retainer Ring Type: AEP III | Membrane Type: Center Bump | PC Diaphragm: Silicon | Brush with Core Type: PP Core | | Software: | Polisher: MB60a1 | Cleaner: CB22p2 | Endpoint: IB11h7 | CPU: Pentium III 400MHz | Dual RAID HardDisk: Yes | HardDisk Size: 68GB | RAM: 128MB | | Upgrade / CIP Retrofit Details: | LLA guide pin: Self Align | Slider motor: 200W | PM reduction kit: Yes | Queue Tub: Yes | Membrane UPA filter: Yes | blackout covers: Yes | Splash guard: Yes | Wind Tunnel: Yes | Exhaust blower: Yes | Magnehelic Pressure Low Level  detection kit: Yes | SRD Exhaust Interlock: Yes | Cassette slot run order (from slot 25 down to 1): Yes | | 2003 vintage.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9071746
    Category:
    Wafer Grinding, Lap...
    CMP System, 8" | Polisher: Mirra 3400 | Controller: 5200 | Cleaner: Mesa | Indexer: Rorze FABS | FOUP's Installed: 3 | Metrology: None | Slurry(P1+P2+P3): ABCD each | Endpoint Laser P1: IScan | Endpoint Laser P2: FullScan | Endpoint Laser P3: None | Polisher Middle Skins: Opaque | UPA: Standard | Chiller: No | Com Port Server: Digi EL160 | Cleaner Brush LDM: User-Modified direct feed LDM with entegris flow sensors | Walking Beam: PEEK Fingers with PP Grippers | Slurry in CLC: Yes | Slurry Arm: 4-line | Polishing Head: Titan I | Rotary Union: 4-port | Cross type: Cattrack | Platen Teflon Coated: Yes | Pad Conditioner Type: Universal | Retainer Ring Type: AEP III | Membrane Type: Center Bump | PC Diaphragm: Silicon | Brush with Core Type: PP Core | | Software: | Polisher: MB60a1 | Cleaner: CB22p2 | Endpoint: IB11h7 | CPU: Pentium III 400MHz | Dual RAID HardDisk: Yes | HardDisk Size: 68GB | RAM: 128MB | | Upgrade / CIP Retrofit Details: | LLA guide pin: Self Align | Slider motor: 200W | PM reduction kit: Yes | Queue Tub: Yes | Membrane UPA filter: Yes | blackout covers: Yes | Splash guard: Yes | Wind Tunnel: Yes | Exhaust blower: Yes | Magnehelic Pressure Low Level  detection kit: Yes | SRD Exhaust Interlock: Yes | Cassette slot run order (from slot 25 down to 1): Yes | | 2001 vintage.
  • APPLIED MATERIALS: Mirra Mesa

    Details
    ID#:
    9063651
    Category:
    Wafer Grinding, Lap...
    CMP system.
  • APPLIED MATERIALS: Mirra 3400 / AS02000

    Details
    ID#:
    9074118
    Category:
    Wafer Grinding, Lap...
    Wafer polishers, 8" | Integration: Mirra and AS2000 | Software: PS58p0 | OS: English | Syscon | I-Pressure pump | Pharmaceutical fluid supply Cabinet | FABS | Manual | 2003 vintage.
  • APPLIED MATERIALS: Mirra Titan II

    Details
    ID#:
    9049234
    Category:
    Spare Parts
    Wafer Size:
    8" 
    Polishing head, 8" | For Mirra profiler, 4-zone.
  • APPLIED MATERIALS: Mirra Titan II

    Details
    ID#:
    9049235
    Category:
    Spare Parts
    Wafer Size:
    8" 
    Polishing head, 8" | For Mirra profiler, 4-zone.
  • APPLIED MATERIALS: Mirra Titan II

    Details
    ID#:
    9049236
    Category:
    Spare Parts
    Polishing head, 8" | For Mirra profiler, 4-zone.
  • APPLIED MATERIALS: Mirra Trak

    Details
    ID#:
    144245
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Vintage:
    2001 
    Oxide CMP system, 8", non-SMIF | Model number: CMP 5201 | Application Oxide | Consumed Process Materials: | Buff Slurry Not used | Pad Conditioner DDF 2 | Pad Conditioner Holder Magnet Type | Factory Interface Options: | Cleaner Type Ontrack | Megasonics None | Robot Type Rorze | In Situ Removal Rate Monitor ISRM (digital) | In Line Metrology Not used | SECS GEM Interface YES | Cassette Tank Not used | Cassette Type 8", Cassette Type | Installation Type FABS 212 | Calibration Tool: | Special Kit for Maintenance None | Dow n force cal. None | Head rebuild kit None | RPM 3 Cal Kits None | Fabs Lap Top Computer None | Platen and Head Options: | Polishing Head Titan 1 head | Retaining Ring 3rd vendor | Pad Wafer Loss Sensor YES | Platen Temperature Control Not used | Long Robot System: | Long Robot Used | Slurry Delivery Options: | Slurry Delivery YES | Slurry Flow Rate YES | Slurry Flow Monitor YES | Slurry Containment Bulkhead YES | Slurry Facilities YES | Slurry Loop Line YES | Slurry Dispense Arm YES | Slurry Leak Detector YES | DI Water YES | High Pressure Rinse YES | System S/W Status: | Mirra Type 3400 | Cleaner Type Ontrack | Fabs type FABS 212 | System Safety Equipment: | Red Turn To Release EMO Button YES | EMO Guard Ring YES | System Labels YES | Earthquake Brackets Not used | Smoke Detector YES | Electrical Requirements: | Line Frequency 50/60Hz | Line Voltage 208VAC | Uninterruptible Pow er Supply Not used | Pow er Lamp Yes | Pow er Connected Lamp Yes | Circuit Breaker Yes | AC Outlet Box Yes | Conf igurable IO Yes | GFI Yes | Factory Hookup: | Upper Exhaust Yes | Low er Exhaust Yes | Upper Exhaust Connection Yes | Drain Manifold Yes | Drain Adapter Yes | Castors for Mirra System Only Fabs | Weight Distribution Plate(Skid pad) NONE | User Interface: | Gray Area keyboard/mouse | Cleanroom Monitor/keyboard/m | Class 1 Cart for 1 Monitor monitor only None/Need to new one if it need | Class 1 Cart for 2 Monitors | Class 100 Cart for 2 Monitors | Stainless Cart Gray area None/ Need to new one if it need | Mouse or Trackball Mouse | Printer Not used | Hard Disk Backup Not used | Polisher/Fabs Light Tower: | Polisher Tower Mounting Type Yes Fabs-Wall mount type | Polisher Tower No of Colors 3 | Polisher Tower Colors Sequence Red/Green/Orange | Cleaner Options: | OnTrak Cleaner Yes HF :1%, Ammonium :29% | Maintenance Options: | Spray Gun Yes | Side Panel Window Yes | Pad Conditioner Cover Yes | Cross cover Yes | Slurry Flow Calibration Kit | Lapping Stone Not used | Robot Door Lock Yes | Special Options: | Nylon Brush Not used | EChain Tef lon Sheet Not used | UPA Upgrade Roof / Stainless | Independent membrane Vac Yes | Low Pressure Release Water | Voltage: 200/208 VAC, 3.0 | Frequency: 50/60 Hz | Full load current: 170A 3 Wire (Delta) | Ampere rating of largest load: 30A | Short circuit interrupt capacity: 10,000A | Ground fault: 25mA | 2001 vintage.
  • APPLIED MATERIALS: Mirra Titan II

    Details
    ID#:
    9049233
    Category:
    Spare Parts
    Wafer Size:
    8" 
    Polishing head, 8" | For Mirra profiler, 4-zone.
  • APPLIED MATERIALS: Mirra 3400 / AS2000

    Details
    ID#:
    9074119
    Category:
    Wafer Grinding, Lap...
    Wafer Polisher, 8" | Integration: Mirra and AS2000 | Software: PS58p0 | OS: English | Syscon | I-Pressure pump | Pharmaceutical fluid supply Cabinet | FABS | Manual | 2003 vintage.
  • APPLIED MATERIALS: Mirra 3400 / AS2000

    Details
    ID#:
    9074117
    Category:
    Wafer Grinding, Lap...
    Wafer Polisher, 8" | Integration: Mirra and AS2000 | Software: PS58p0 | OS: English | Syscon | I-Pressure pump | Pharmaceutical fluid supply Cabinet | FABS | Manual | 2003 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9056034
    Category:
    Wafer Grinding, Lap...
    CMP system.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9067393
    Category:
    Wafer Grinding, Lap...
    Systems, 8" | Non-SMIF.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    112322
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    CMP Tungsten system, 8" | Includes: DAINIPPON AS-2000 cleaner unit | CMP polishing type: Titan profiler | Inline endpoint monitor ISRM (In-site removal rate monitor) | Configuration: | 4 cassette port | DAINIPPON AS-2000 cleaner unit | Mirra polishing unit: (1) loadcup, (3) platens | Wafer transfer unit | Inline lifter unit | Mirra wet tub: (1) cassette port | Mirra wet tub cassette holder | DIW distribution unit | NESLAB HX300 chiller | Front CRT | Rear CRT | System controller | DIW booster pump unit | Trans unit | NH4OH dilivery system | HF delivery system | NH4OH 1 stock solution delivery system | NH4OH 2 stock solution delivery system | HF stock solution delivery system | (8) polishing heads.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9017016
    Category:
    Wafer Grinding, Lap...
    CMP-Poly system, 8" | (4) Head | Titan 1 | (3) Platen | Software version: PB58n5 | CPU: Pentium | SECS: SECS II | UPS: no | In-situ-measurement (NOVA): not included | End point detector: not included | | Wafer specification: | Wafer shape: SNNF | Wafer cassette: 8" Bishop CR200A-02B3-H/PEEK material | SMIF interface: no | | Configuration: | Loading configuration: (4) wet stage loaders | Load cup: standard | Temperature control: no | Head type: Titan 1 | Head number: 4 | Slurry supply: 2-line | Platen: 3-platen, POUs: slurry / DIW | Controller units: 1 | | 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9067914
    Category:
    Wafer Grinding, Lap...
    W CMP integration system, 8" | (3) Platens | (4) Heads | (1) Cleaner.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9074116
    Category:
    Wafer Grinding, Lap...
    Polisher, 8" | Stand alone | | Wafer shape: Notch type | Process type: STI CMP | Device type: Logic | Polish slurry: Oxide | Platen 1 Pad: IC1010 Pad | Platen 2 Pad: IC1010 Pad | Platen 3 Pad: IC1010 Pad | Pad Conditioner: DDF 3 | Pad Conditioner head: Snap on type | Pad Conditioner holder: Magnetic holder | | Robot type: AMAT Long Robot | In Situ Removal rate monitor: ISRM (Digital) P1,2,3 | SECS GEM Interface: Yes | Cassette tank | Cassette type: 8", 4-ports | Integrated system basic FABS: None | | (9) Polishing heads: Titan-1 Head | Retaining ring: PPS | UPA/Rotary joint: STD 3-ports | Pad wafer loss sensor: Yes (Dual sensor) | Platen motor gear box: P1 stober, P2, 3 Alpha | Plate temperature control: None | | Slurry delivery: A, B line P1,2,3 | (6) Rotary pump type | Slow flow rate: Yes | Slurry flow monitor: Yes | Slurry containment bulkhead: Yes | Slurry facilities: Yes | Slurry loop line: Yes | Slurry dispense arm: Long arm | Slurry leak detector: Yes | Di water: Yes | High pressure rinse: Yes | | Mirra VME Type: Redisys P-I type | Mirra Software: PS58p0; ISRM: 1S11g6 | | Red turn to release EMO Button: Yes | EMO Guard ring: yes | System labels: Yes | Earthquake brackets: Yes | Smoke detector: Yes | | Line frequency: 50/60 Hz | Line voltage: 208 VAC, 3-wire Delta | Uninterruptible power supply: Yes, VME Rack | Power lamp: Yes | Power connected lamp: Yes | Circuit breaker: Yes | AC Outlet box: Yes | Configurable IO: Yes | GFI: Yes (100 mA) | | Polisher to controller cable: STD 50 ft | Controller to monitor cable: Yes | Slurry system interface cable: None | | Upper exhaust: Yes | Lower exhaust: yes | Upper exhaust connection: yes | Drain manifold: Yes | Drain adapter: Yes | | Gray area: Monitor, keyboard, mouse | Cleanroom: Monitor, keyboard, mouse | Stainless cart: Cleanroom, gray area | Mouse | Printer | Hard disk backup | | Polisher tower mounting type | Polisher tower No. of colors: (3) | Polisher tower colors sequence: Red/Yellow/Green | | Spray gun: Yes | Side panel window: Yes, clear type | Pad conditioner cover: Yes | Slurry flow calibration kit None | Lapping stone: None | Robot door lock: None | | Nylon brush | E-chain teflon sheet: Yes | | (1) DIW Booster unit | | No Cleaner | (3) Polisher lower base cover missing | | 1999 vintage.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9067916
    Category:
    Wafer Grinding, Lap...
    Wafer Size:
    8" 
    Poly CMP integration system, 8" | (3) Platens | (4) Heads | (1) Cleaner.
  • APPLIED MATERIALS: Mirra 3400

    Details
    ID#:
    9067915
    Category:
    Wafer Grinding, Lap...
    Oxide CMP integration system, 8" | (3) Platens | (4) Heads | (1) Cleaner.
Copyright © 2011 Capital Asset Exchange & Trading LLC. All rights reserved.