CMI 950 Products

Combination system | Measure methods: microresistance, eddy current/magnetic induction/nickel over nonmagnetic, and beta backscatter | Used to test electronic boards | Configuration: | CMI MFX controller with manual | Thickness gauge head unit | Thermal printer | CMI MFX controller, P/N: 200220: | Probe ports: BMX, MRX, EMX | RS-232 Interface | Parallel Printer port | Footswitch port (footswitch not included) | VAC: 90-230 | Hz: 50-60 | TRP-1A/S thickness gauge head unit, P/N: 200955 | Display port: 25 pin | Cables included: controller power cable, thickness guage power cable, printer ac adaptor, printer cable, display cable.

Coating measurements instruments x-ray XRF analyzer, for parts | Part number: CMI 900 | Power requirements: 115 VAC, 2 A, 50-60 Hz | Not operational.

Laser Diode WL 780NM.

Spectrophotometer.

AKTA Fraction collector.

Power supply.

Analyzer.

UV/Vis spectrometer | | Includes: | Relative specular reflectance accessory (6DE) | Plane mirror | Integrating sphere, 60 mm | Variable angle trans | UV WinLab software | Dell OptiPlex 745 PC with Windows XP (SP2) | | 2008 vintage.

URS Tester.

Microscope, 5".

Shorts locators.

UV/Vis/NIR spectrometer | Part No. L6020036 | Universal reflectance accessory Part No. L6020202 | 6" Integrating sphere | Winlab 6.0 PC workstation | 2009 vintage.

Cassette to Cassette UV Flood Exposure System, 6" | Includes: | Robotic substrate handling system | UV lamp housing | Intensity controlling power supply | Lamp housing will support up to 1000W lamp | Configured for 365 to 400 nm | 120V, 60 Hz.

RF Preheater | Power Output: 15 Kilowatts | Preheating capability (typical resins): 10 pounds in 1 min. | Top Electrode Dimensions: 18" x 24" | Top Electrode Spacing (Adjustable): 1.5” Minimum, 4.5” Maximum | Oscillator Tube: Type V 6-3A | Operating Frequency: 68-82 MHz Low Voltage / 63-69 MHz High | D.C. Power Supply: Solid state diode, MOV protected full wave, 3ø | Electric Power Input: 230 v. 3 ph, 70 Amps/ph-230 V | Automatic Hood, Compressed Air" 80 PSI (Dry) | Buttons: Start/Stop | Lights: Ready, RF ON, O/L | Meters: plate / grid | Timers: RF Timer (0-2 1/2 minutes), Delay Timer (0-2 1/2 minutes).

Digital computer torque tester.

Lot of Equipment: | | Qty Equipment | 1 Ring setting machine | 1 Ring setting machine | 1 Union Tool Union Tools Ring setting machine | 1 Ring setting machine | 1 Grinding mc | 1 Non contact sensor | 1 sensor | 1 Union Tool Union Tools Sensor OPTECH-R1-2 | 1 Digital gauge | 1 Thickness measurement | 1 Compressor | 1 Compressor GA160-125 | 1 Air compressor | 1 Dimension Measuring equipment | 1 Piping for Air | 1 Air compressor300hp | 1 Dryer for air | 2 Klingerberg Drilling m/c-KLB 76-6KD | 2 Klingerberg Drilling m/c-KLB 76-6KD | 1 Klingerberg Drilling m/c-KLB 76-6KD | 1 Klingerberg Drilling m/c-KLB 76-6KD | 1 Klingerberg Drilling m/c-KLB 76-6KD | 1 Klingerberg Drilling m/c-KLB 76-6KD | 1 Klingerberg Drilling m/c-KLB 76-6KD | 1 position hole driller | 1 Hydraulic punch mc | 4 Klingerberg Drilling m/c-KLB 76-6KD | 4 Klingerberg Drilling m/c-KLB 76-6KD | 2 Klingerberg Drilling m/c-KLB 76-6KD | 1 Posalux POSALUX drilling mc 6000-4D | 1 Posalux POSALUXdrilling mc 8400-C-8 | 1 Multiline Punch machine SPE-0228 | 1 Posalux POSALUX drilling mc 8400-6D | 1 Posalux POSALUX drilling mc 8400-6D | 1 Posalux POSALUX drilling mc 8400-6D | 2 Posalux POSALUX drilling mc 8400-6D | 2 Posalux POSALUX drilling mc 8400-6D | 3 Posalux POSALUX drilling mc 6000-4D | 1 Deburring mc drilling | 1 Posalux POSALUX drilling mc 6000-6D | 1 Posalux POSALUX drilling mc 6000-6-LZ | 1 Hitachi Laser driller HITACHI LC-1C 21E/C | 1 Hitachi Laser driller(B) | 1 Hitachi Laser driller(A) | 1 Belt type PP drilling mc | 1 Hitachi Laser driller HITACHI LC-1C 21C/1 | 1 Li Soong Router LS-4AL | 3 Posalux POSALUX drilling mc 6000-8D | 1 Li Soong CNC Router LS-5LCL | 1 hole location tester NXR-1002 | 3 Dust collector | 1 Dust collector and piping | 1 Dust collector and piping | 1 Dust collector for Laser driller AWS4-2 | 1 Dust collector for Sawing mc AWD18-3 | 1 Dust collector 20HP exhaust piping | 2 Dust collector after lamination AWD8-2 | 2 Dust collector 25HP exhaust piping | 3 Hino Hi Eff. Power stabilizer | 1 Hino Power stabilizer-hino | 1 Hino Power stabilizer-hino | 1 Hino Power stabilizer-hino | 1 Hino Power stabilizer-hino | 3 Hino Power stabilizer 30KVA- | 2 Hino Power stabilizer 150KVA- | 1 Hino Power stabilizer 30KVA- | 1 Auto Pinning mc | 1 Auto Pinning mc | 1 Shimadzu X-RAYtarget hole drilling mc | 1 Shimadzu X-RAY target hole drill mc SPX-1229D | 1 Yayatech X-RAY Inspection m/c | 1 Seiko X-RAYtarget hole drill mc MMX-880 | 1 Drill bit inspection mc | 1 Yayatech hole counter HC-610 | 1 Local X-RAY target hole drill mc DX4H2 | 1 X-RAYtarget hole drill mc | 1 Flying Probe tester | 2 Planmaster PLANMASTER CAM system | 2 Planmaster PLANMASTER CAM system | 1 O/S Tester | 1 AEMG PCB Hole AOI | 1 V-CUT mc SVD-450A | 1 PP cutter | 1 copper foil cutter | 1 PP cutter | 1 PP cutter SMC-111 | 1 PPslitter VNC-55 | 2 Oven G0C-9D | 1 Oven for B/O NHOC-12080D | 1 Auto breakdown, conveyor, recircuiting for lamination | 1 Loader & unloader for cleaning mc after lamination | 1 Laser plotter -FIRE9370 | 1 Artwork loader & unlader | 1 Fuji Fuji film developer | 1 Wire bonding mc HPC-596 | 1 Wire bonding mc | 1 Wire bonding mc CF100CE, pedal type | 1 Microscope & photo eq. | 1 CCD micro vision | 1 CCD micro vision | 1 Buffer paper cutter | 1 Buffer paper cutter | 1 Diamond saw cutting mc | 1 Schelling Diamond saw cutting mc FL-M180 | 1 Steel plate for cutting mc | 1 Buffer paper cutter | 1 Heat Transfer oil system | 1 heat transfer oil boiler | 1 Filter of brushing mc for steel plate | 1 Brushing mc for steel plate | 1 Brushing mc for D/F laminator | 1 Brushing mc for steel plateSPI-25 | 1 Brushing mc for steel plateSPI-25-2 | 1 MacDermid Mac Dermid brushing mc for IL | 1 Brown oxide additional eq. | 1 Brown oxide line 2 | 1 Brown oxide line 1 | 1 Brown oxide3.5M(Mac Dermid) | 1 IL pretreatment line | 1 Black oxide line | 1 Brown oxide line | 1 Additional tanks for acid cleaning | 1 horizontal oven for pre-treatment | 1 400HP Dryer for com. Air | 1 Black oxide auto line | 1 Black oxide auto line | 1 Lien Chieh Lamination Press LHMCVL-560-100-6 | 1 Lien Chieh Lamination Press | 1 Lien Chieh Lamination Press, system | 1 Burkle BURKLE Press | 2 Surface cleaning mc | 2 Surface cleaning mc CM-620 | 4 Surface cleaning mc CM-620 | 2 Surface cleaning mc CM60600UMF | 1 Surface cleaning mc YC-650IV | 2 Surface cleaning mcYC-650FP-2S | 1 Surface cleaning mcYC-650-2S | 1 Surface cleaning mc YC-650FP-2S | 3 Surface cleaning mcYC-650-2S | 4 Surface cleaning mcYC-650-6S | 3 Surface cleaning mc | 1 Surface cleaning mc BD-650 | 1 Surface cleaning mcYC-650TF4R-2S | 2 Surface cleaning mcYC-650TF4R-2S | 2 FeCl3 regernation system | 1 FeCl3 regernation system | 1 Hollmuller DES Line | 2 CuCl2 regeneration eq. | 1 CuCl2 regeneration eq. | 1 CuCl2 regeneration eq. | 1 Manual exposure mc | 2 Mania Mania auto exposure mc MAX-9820U | 1 ORC, Japan ORC auto exposure mc EXM-2010SR | 2 Mania Mania auto exposure mc MAX-9820U | 1 ORC, Japan ORC auto exposure mc EXM-2010SR | 1 Automatec auto exposure mc 5KW Automa Tec | 2 ORC, Japan ORC auto exposure mc | 2 Orbotech Orbotech DP-100SL | 1 Edge buffing mc LS-D | 1 Auto edge trim & buff line | 1 Auto edge trim & buff line | 1 Edge buffing mc JH-299 | 2 2 axis riveting mc | 1 1 axis riveting mc | 1 Hole drilling & riveting mc | 1 1 axis riveting mc JS-732 | 1 2 axis riveting mc JS-7729 | 2 1 axis riveting mc | 1 2 axis riveting mc | 1 3 axis L Type riveting mc JS-7739B | 1 Schmid SCHMID DES line | 1 Schmid SCHMID DES line | 1 Schmid SCHMID DES line | 1 High pressure water cleaning mc | 1 High pressure water cleaning mc | 1 Pre-treatment line additional acid cleaninh tanks by Mac Dermid | 1 Steel plate surface cleaner YC-1420 | 1 Steel plate surface cleaner YC-1000 | 1 Cleaning mc after lamination LM-MS045Z001 | 1 Steel Plate Cleaning mc YC-1420 | 1 Pre-treatment line for IL | 1 Pre-treatment for D/F Laminator | 1 Schmid SCHMID DES line | 1 X-RAYtarget hole drilling mc | 1 IL alignment hole drill mcDR-1800-CCD | 1 IL alignment hole drill mcDR-1800-CCD | 1 Local X-RAYTarget hole drill mc CH-608 | 2 Orbotech Orbotech AOI-PC-1450E | 1 Orbotech Orbotech VRS-4LI | 1 Orbotech Orbotech VRS-4LI | 1 Orbotech Orbotech AOI IS-9060-AR+VRS-4LI2? | 1 Orbotech Orbotech AOI IS-9060-AR | 1 Orbotech Orbotech VRS-5 | 2 Orbotech Orbotech AOI IS-9060-AR | 3 Orbotech Orbotech VRS-5 | 1 Orbotech AOI Accessories US-EU W/S DSV-EU | 1 Orbotech Orbotech AOI IS-9060-AR | 2 Orbotech Orbotech VRS-5 | 2 Orbotech Orbotech VRS-5 | 1 Orbotech Orbotech VRS-5 | 1 Orbotech Orbotech VRS-5 | 3 Orbotech Orbotech AOI IS-9060-AR | 1 Orbotech ACCESSORIES for AOI | 2 Orbotech Orbotech AOI IS-9060-AR | 2 Orbotech Orbotech VRS VERISMART | 1 Orbotech Orbotech AOI V-350 | 2 Orbotech Orbotech AOI DISCOVERY820 | 3 Orbotech AOI VRS VERISMART-A | 1 Burkle Roller coater | 1 Burkle Roller coater BURKLE | 1 Burkle Roller coater BURKLE | 1 SCHMID DES line installation | 1 CSI (Canada) Laser Plotter | 1 artwork protective film lamination mc | 1 Hakuto HAKUTO DF laminator MACH6101 | 1 Orbotech Orbotech AOI-PC-1450E | 1 Auto breakdown, conveyor, recircuiting for lamination | 1 Auto breakdown, conveyor, recircuiting for lamination | 2 X-RAYInspection m/c | 1 Multiline Punch mc OPE-0366 | 1 Multiline Punch mc OPE-0366 | 1 Cu SO4 Recycle mc | 2 Cu SO4 Recycle mc | 1 Copper powder filter | 1 Auto loader & unloader | 1 loader & unloader and centering | 1 Unloader with separator | 1 Horizontal loader TC-08 | 2 Horizontal loader TC-02 | 1 Temparory storage rack TC-10 | 1 Centering device TC-11 | 1 Inclined unloader TC-3 | 2 Inclined unloader TC-3 | 4 Conveyor C/N | 1 Unloader & temparory storage rack TC-04 | 1 Loader TC-01 | 2 Loader 620*580mm | 1 Belt type loader HTC-1000-L | 1 horizontal loader HTC-1000-L | 1 horizontal loader and unloader HTC-1000-P | 2 Loader TC-01 | 2 conveyor C/V | 1 Centering device | 1 Centering device | 1 direction change mc TC-09 | 1 vertical unloader TC-17 | 1 Horizontal loader TC-08 | 2 horizontal loader and unloader HTC-900-P-XL | 2 horizontal loader and unloader HTC-900-P-XL | 1 Stamping mc NP-800 | 2 Loader HTC-YV08 | 1 horizontal loader and unloader HTC-900-P-XL | 1 horizontal loader and unloader HTC-900-P-XL | 3 Loader YU-0845A | 1 Unloader YU-0845A | 1 Unloader YU-0860RA | 1 Temparory storage rackHTC-A15 | 1 conveyor XYZ-1531 | 3 AOI loader & unloader HTC-900-P-XL | 1 Stamping mc XYZ-32 | 4 Loader HTC-900-9-XL-0 | 4 Unloader HTC-900-9-XL | 1 Copper powder recycle mc | 1 OPLTemparory storage rack | 1 direction change mc | 1 Temparory storage rack | 1 direction change mc | 1 Inclined unloader | 1 A07unloader with separator for DES#4 | 1 loader | 1 unloader | 1 direction change mc | 1 Temparory storage rack | 1 connection device for D/F laminator | 1 Stamping mc XYZ-32 | 1 conveyor XYZ-1531 | 1 Alignment mc HTC-B01-55 | 1 Edge buff loader with separator HTC-950-P | 1 PC for SCHMIDDES#1 | 1 30T A/C | 1 Engineering for A/C | 1 Hitachi movable A/C | 7 Hitachi A/C 5T RD-51 | 1 Cooling Tower | 3 Cooling Tower (700RT) | 1 Cooling Tower(6000L) | 12 SUS water storage tanks | 1 Cooling water piping | 1 Generator | 1 CNC Drilling connection to generator ATS | 1 Diesel generator 500KW | 1 Power stabilizer 100KVA | 1 Power stabilizer (3 phase 75KVA) | 1 Power stabilizer | 1 hydraulic up &down table | 5 hydraulic up &down cart | 1 sheering mc | 1 sheering mc | 1 storage cabinet for film | 1 Elevator 3000KG | 1 Elevator 5000KG | 1 Floor washing mc COMAC | 1 Fork lift | 10 SUS Rack &cart | 10 SUS Rack &cart | 3 Cart for drill bit plate | 1 Chill water | 1 32L DI water | 1 5T/hr DI water 16T/hr | 1 Chill water 200RT | 1 Tensile strength tester | 1 water storage tank | 1 water storage tank | 1 water storage tank | 1 Filter for chill water | 1 CMI Plating thickness tester CMI 600 | 2 2 pcs detector DD-860u | 1 CCD Microscope 300X | 1 UV detector (Labino)Trac Pack | 1 Lab. Eq. | 9 Pass box | 3 Pass box | 1 Pass box | 1 Storage rack(Rivet rm)11cavity | 1 Storage rack(Rivet rm)10cavity | 8 Teflon Rack | 1 Hitachi A/C 5T | 1 Vacuum packing mc | 2 Pump | 1 AOI information system | 1 DNC information system for CNC | 1 Waste water treatment | 1 Waste water treatment | 1 Waste water treatment | 1 Compressing mc for waster water.

CNC EDM machine | Control: LN1(40B) | Table size: 900 x 750 mm | Working size: 1100 x 950 x 500 mm | Stroke (X,Y,Z): 700 x 500 x 350 mm | Max. working weight: 2000 kg | Distance between the electrode surface from the mounting surface level Tablespoons: 300-650 mm | 2001 vintage.

4-axis CNC turning/mill center lathe with live tooling | Equipped with: | Acramatic 950 CNC control with 14" color CRT | 12" 3-jaw front actuated hydraulic chuck | Upper and lower turrets | Live spindle milling/drilling tool turret option | Full contouring C-axis | Programmable tailstock option | 50 HP spindle drive | Dual 8 tool simultaneous tool turrets ( 16 total tools) | Chip conveyor | Coolant system | Steady rest | Tooling package | | Max swing over slant bed: 22.00" | Max swing over crosslide ways: 12.5" | Max machinable center distance: 40" | Cross travel (X-axis): upper slide above center: 8.875" and lower slide below center: 5.5" | Longitudinal travel (Z-axis): upper slide: 38" and lower slide: 44" | Feed range X & Y-axis (infinetly variable): .1-200 IPM | Rapid traverse rate X & Y axis: 400 IPM | Tool positions (8 on each turret): 16 total | Spindle bore: 3.15" | Spindle nose: A2-8 | Spindle speed range: 88-3500 RPM | Spindle horsepower: 50 HP | Approximate machine dimensions: 208" x 96" | Approximate machine height: 95" | Approximate machine weight: 24,000 LBS | 1992 vintage.

Brazing oven | Specifications: | Heating tunnel length: 2500mm | Loading/unloading zones length: 550mm | Conveyor: | Belt width: 240mm | Metallic belt: AISI 330 | Maximum temperature of belt: 600°C | Conveying height: 950 ± 25mm | Product clearance: 10 to 50mm | Left to right conveyor flow | Conveyor speed accuracy: ± 1% | Conveyor stop safety and speed display | Torque control | Speed ration: 1 to 5 | Process atmosphere: | Nitrogen atmosphere | Oxygen level: 10 to 50 ppm | Heating tunnel: | Composition tunnel: | Entrance barrier: 350mm | Heating module: 1200mm | Heating on (4) sides of the muffle | Number of zones: 8 | heating zones length: 4 boxes of 300mm | Stabilization time from ambient to process temperature: 30 min | Temperature monitoring: | Process temperature: 600°C | Regulation accuracy: ± 2°C | Overall heating power: 20kW | Cross belt homogeneity: ± 3°C | Control type PID | Number of thermocouples: 1 per zone | Cooling: | Water jacket: 600mm | Exit barrier: 350mm | Control: | Type of control: Industrial Automate for regulation | Supervisor: Portable PC, Windows 98.

Defect Review system, 8" | | Throughput: | Wafer Overhead (In pipeline mode): 90 sec | Defect throughput (single wafer): 1000 defs/hr | Cell to Cell ( single wafer ): 1300 defs/hr | Wafer throughput (50 defects/wafer): 11 wafers/hr | Wafer breakage: better than 1 in 10,000 runs | | ADR: | Low sensitivity: 1000 defs/hr | Medium sensitivity: 720 defs/hr | High sensitivity: 480 defs/hr | ADR + ADC: | Low sensitivity: 950 defs/hr | Medium sensitivity: 600 defs/hr | Cell to Cell ( ADR ): | Low sensitivity: 1300 defs/hr | Medium sensitivity: 900 defs/hr | High sensitivity: 630 defs/hr | | Redetection: | Bare: | Redetection success rate: 90% for defects > 0.10 um | Redetection reproducibility: 95% | | Pattern: | Redetection success rate: 90% for defects >0.07 um | Redetection reproducibility: 95& | | Automatic defect classification: | Classification global accuracy: 80% | Classification reproducibility: 90% | | Bare wafer review and classification: | Defect throughput (single wafer): 480 defs/hr | Wafer throughput (50 defects/wafer): 6 wafers/hr | Defect throughput with material ID: 140 defs/hr | Wafer throughput with material ID (50 defects/wafer): 2.5 wafers/hr | Typical EDX acquisition time: 6 sec | | Defect file type: All | | Sem: | Resolution: 3.5 nm @ 1 kV (0° tilt) | Accelerating Voltage: 150V – 15kV | Magnification: 500s - 200,000x | Multi perspective SEM imaging | Voltage Contrast imaging | High Aspect Ratio imaging: 10:1 | Auto focus | | Image stability | Gun life time: > 1 year | Gun bake out frequency: 6-12 months | Probe current monitor system | | Optical microscope | Objective lenses: 2.5x, 20x, 100x | | Stage | X, Y coordinates accuracy at 0° tilt: +/- 1.5um | Tilt: 0 °, 15°, 45° discrete tilting | Tilt position exchange time: 35 s | Tilt eucentricity: +/- 10 um | Rotation: 0°, 45°, 90°, 180° discrete positions (programmable) | | EDX | Typical acquisition time: 6 sec | Resolution: Mn 138 eV | Resolution: F 82 eV | | Cleanliness | Class 1 clean room compatible | Front side wafer: 0.013 PWP/cm^2 @ > 0.12 um | Back side wafer: 0.14 PWP/cm^2 @ > 1 um or 13 PWP/cm^2 @ > 0.2 um | | Metal contamination | Cr, Ni, Cu, Zn, Fe: 5E10 At/cm^2 | Al, Ca: 1E12 At/cm^2 | | Image storage: more than 10,000 | TIFF image format | | Handling yield: 99.99% | Uptime: 93% | MTBF: 750 hr | MTBA: 60hr | PM: 3.75 hr/week | | Industry standards | S2-0200 compliance | S8-95 compliance | CE-Marking compliance | | Can be inspected | 1999 vintage.