OERLIKON ESEC 3100 Products

Wire bonding machine.

Wire bonder | 2004 vintage.

Wire bonder | 2007 vintage.

Wire bonder | 2007 vintage.

Wire bonder | 2010 vintage.

Wire bonder | 2004 vintage.

Bonders.

Wire bonder | 2004 vintage.

Wire bonder | Includes STIM 210 solution | 2011 vintage.

Wire bonder | 2004 vintage.

Wire bonder | 2005 vintage.

LCD Terminal for ESEC 2006.

Lot of wire bonders: | (Qty 1) ESEC SEMPAC WIRE BONDER | Type W112 | Model Number 3006S | Fab No 300357 | Year 1999-2000 | (2) ESEC SEMPAC DIE BONDER | Type D112 | Model Number 2006S HR | Fab No 202293 | Hitachi Camera - Model KP-140U - DC 12V | Year 1999-2000.

Bonders.

Automated Gold Ball Bonder | Flying bondhead operates by means of a frictionless air bearing | System has programmable focus option | E-Stop and Venturi vacuum | 2"x 2-1/2" work table travel | Programmable X-Y-Z indexer | Currently 80 micron machine but upgradable to 65 micron | Installation and custom configurations available at added cost.

Bonder.

Bonder | Does not have reel to reel | Has fine pitch capability and it is set up to accept programmable focus | Currently installed | Powered down in 2010.

die bonder: magazine to magazine, 6" wafers, programable indexer, top stockloader, unknown vintage.

Parts Unloader for Micron 2 Automatic Die Attacher.

Auto die bonders | Cassette to cassette | (3) for TO 220 | (3) for SOT 223 | Configured for solder die attach | Can be modified to customer requirements.