STS MULTIPLEX ASE HRM Products

  • STS: Multiplex ASE ICP

    Details
    ID#:
    9032748
    Category:
    Etchers / Ashers
    Etcher, 6" | Manually load system with Load Lock | Clamp style (2 " to 8" capable) | Leybold MagLev pump | ENI RF power supples with Match work and tuners | Onboard Mini-Box GasBox, 4 line (includes 3 MFCs - SF6 300sccm; O2 100sccm; Ar 50sccm) | Chamber pump: Edwards iQDP80 | Loadlock pump: Edwards iQDP40 | 208 VAC | 2000 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    184607
    Category:
    Etchers / Ashers
    Wafer Size:
    6" 
    Vintage:
    1996 
    Cluster system, with single Multiplex ICP ASE chamber, 6" | Setup to run Bosch Process (deep silicon etching) | Vacuum Load-lock For Single Cluster Chamber Multiplex systems (MESC): | 5 Chamber capability | 1 chamber currently installed (ICP ASE) | Cassette Load Lock | Wafer Breakage Sensor | Fully automatic transfer of substrates between the load-lock and the process chamber | Loader may be configured for substrates up to 8" in diameter (or batches of smaller substrates) | Setup to handle 6" diameter wafers | Can be upgraded to handle 8" wafers | Vent gas line | Pirani gauge lock pressure measurement | ISO 40 pumping port | ISO 40 Poppet valve | Modular electronic interface system controlled by the process module PC | Compressed air back up unit (CAB) | Multiplex DRIE (ICP) Process Chamber: | Production proven single wafer process chamber (aluminium) | Backside wafer Helium cooling | Mechanical clamping wafer chuck | 13.5" ID Ceramic Chamber | Combined showerhead gas inlet/upper electrode | Capacitance manometer pressure gauge | PID temperature controlled wafer platen | PID temperature controlled upper electrode | Vent gas line | Two chamber view ports | Chamber optical analysis port | Chamber KF40 analysis port | Pneumatically operated high vacuum chamber isolation slit valve | Chamber over pressure sensor interlocked to gas inlet | Chamber lid temperature control | Remote sealed extracted gas box with orbitally welded gas lines | Electronics cabinet housing main system AC distribution panel with breakers for all sub-circuits | Pentium based process module control computer | Monitor | Menu pages for multistep process definition | Floppy or hard disc storage of process recipes | Fully automatic multistep processing or manual operation | ENI ACG-3 300 Watt RF Generator | ENI ACG-10B 1000 Watt 13.56 MHz RF Generator | Gases: | C4F8 - 200 sccm | SF6 - 300 sccm | N2 - 100 sccm | N2 - 100 sccm | Edwards E2M40F PFPE Rotary Pump (Fomblin) for Cassette Loader: | Edwards E2M40F fomblinised rotary pump | Exhaust oil mist filter | N2 bleed assembly to prevent oil pump backstreaming | Edwards E2M40F PFPE Rotary Pump for Dealer Load Lock: | Edwards E2M40F fomblinised rotary pump | Exhaust oil mist filter | N2 bleed assembly to prevent oil pump backstreaming | Other Pumps and equipment: | Pfeiffer TMH1000C Turbo Pump | Pfeiffer TPH240C Turbo Pump | Edwards QDP80 Roughing Pump | Neslab CFT-75 chiller | Operations Manuals, Electrical Drawings | Auxilary Equipment Manuals and Documentation (Complete Manual Set) | Currently installed | 1996 vintage.
  • STS: ICP ASE

    Details
    ID#:
    166201
    Category:
    Etchers / Ashers
    Wafer Size:
    8" 
    Silicon Plasma Etch System, 8" | | Eni Acg-1087 Rf Generator | Vl-400 Phase Shift Generator | Cluster Multiplex Ppd.
  • STS: Multiplex

    Details
    ID#:
    9021351
    Category:
    Etchers / Ashers
    Wafer Size:
    2"-8" 
    Vintage:
    1999 
    ASE AOE ICP cluster tool, 2"-8" | Set wafer size: 6" | Process capabilities: silicon and oxide etch | | Chamber 1 description: | Vacuum system: | Edwards model QDP80 vacuum pump | Edwards model QMB250F mechanical booster pump | Leybold model Mag W 2000 CT turbomolecular pump | Gas inputs: Eleven Tylan model FC2900M MFCs | | Chamber 2 description: | Vacuum system: | Edwards model QDP80 vacuum pump | Edwards model QMB250F mechanical booster pump | Leybold model Mag W 2000 CT turbomolecular pump | Gas inputs: Eleven Tylan model FC2900M MFCs | | Controller type: PC | Software revision level: version 8 | Elevator type: Brooks Automation | Process gases: C4F8, SF6,O2,Ar, C3F8, CF4, Cl2, BCl3, HBr, N2 | External cooling: water cooled | | ICP controller 1: | Leybold model Mag Drive 2000 electronic frequency converter | Vat model PM7 adaptive pressure controller | | ICP controller 2: | Leybold model Mag Drive 2000 electronic frequency converter | Vat model PM7 adaptive pressure controller | | Dealer robot: Brooks Automation model 001-7500-02 | | Vacuum cassette load lock handler: | (1) Brooks Automation model 001-9300-57 | Load lock pump: Edwards QDP40 vacuum pump | | Generator rack: | Advanced Energy model LF-5 RF generator | (2) Advanced Energy model RFG 3001 generator | (2) ENI model ACG-3B RF generator | | (2) Taitec Corporation model UC-70 recirculator/chiller | | Power requirements: | 208 V, 3 phase, 60 Hz | | 1999 vintage.
  • STS: ASE

    Details
    ID#:
    201044
    Category:
    Etchers / Ashers
    Vintage:
    1999 
    ICP system | Brooks cluster vacuum substrate handler | | Multiplex ASE ICP process module: | Low pressure plasma processing chamber | Inductive coupled high frequency source 3 kW (13.56 MHz) RF matching network | 300/30W (13.56 MHz) RF supply and matching network | Phase lock unit for (2) 13.56 MHz P.S. | Temperature controlled (-40C to -45C) | Substrate susceptor | Mechanical wafer clamping with backside cooling (8" configuration) | Gas lines: SF6, C4F8, O2, Ar, CF4, CHF3, HBr | Deep silicon trench process package | | Includes Edwards QDP40 dry pump, Edwards QDP 40/QDP 250 blower, manuals | 1999 vintage.
  • STS: MXP Multiplex

    Details
    ID#:
    9005443
    Category:
    Etchers / Ashers
    ICP ASE HR Silicon Etch Bosch Process System, 6" | Capable of 2"-8" | | Loadlock | Loadlock pump: Edwards E2M40 | | High Vacuum Pump Pfeiffer MAG 2000 | Roughing Pump Edwards IQMB250 & IQDP80 | RF Generator Model ENI/ACG-3B and Advanced Energy RFG 3001 | Number of Gas Inputs Four Gas | Process Gases SF6, C4F8, O2, Ar | | Chillers | Number of Chillers 1 | Chiller #1Manufacturer/Model Huber/Unistat 140W | | Accessories: | ICP V2 - Balun coil | Mechanical Clamp | Helium Backside Cooling | Carousel in MkIV MPX - 2 x 150mm wafers | 3KW Source | 300/30W platen | E-Rack Modules: HCL1 +HCU3 +HCU5+VAC3Y +2x AMC1 +HBC2 | | Windows 2000 | Bosch license | Current Power Requirements: 400V , 50Hz, 40 Amp, 3 phase | Unit can be configured for: 208/460, 60 Hz, 3 Phase | CE Marked | 2003 vintage.
  • STS: Multiplex 320

    Details
    ID#:
    104659
    Category:
    Etchers / Ashers
    Wafer Size:
    2" - 8" 
    RIE system | Manual load-lock batch plasma etch system | The wafer platen can accommodate a variety of substrate sizes from 2" up to 8" | | The process chamber is configured for sputter and/or reactive etching of a large range of materials including: | Metals | Dielectrics | Photoresist | Many Inorganic and Organic substances | | The plasma is produced via the matching unit into an alumina chamber | This provides a high density plasma capable of operating in a very wide process range | Independent energy control is provided by 13.56 MHz Freq biasing of the substrate platen via automatic power control and impedance matching | System is designed for maximum process flexibility and reproducibility | Process gas is introduced to the process chamber through a showerhead arrangement, which is located in the upper cover assembly | The substrates are placed on the electrode assembly which is powered at 13.56 MHz | Temperature control of the substrate platen which is required for certain processes is achieved using a recirculating liquid system | Unit chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks | This results in a very stable chamber environment leading to processes of the highest quality | The aluminium load-lock has a transparent hinged lid which allows easy access for loading/unloading of the wafer carrier | After loading of the wafer into the load-lock, the system automatically carries out pumpdown, leak check and transfer of the wafer into the process chamber via the carriage assembly, after which the process will be started | The MULTIPLEX RIE control is via an Industry standard Personal computer. A color monitor displays process information and mimic displays, allowing the system to be operated and continuously monitored | Process recipes are downloaded to hard or floppy disk | The system is run in automatic mode | In the event of system external service malfunction, one of the comprehensive set of diagnostic legends is displayed, and the machine is automatically placed in a safe condition | The system footprint may be minimized by remoting the sealed extracted gas cabinet from the etch console | Access to the system is provided at the rear and side of the machine allowing unimpeded maintenance access to all major components | Various pumping combinations may be connected to the high conductance pumping lines, depending on process requirements.
  • STS: Multiplex

    Details
    ID#:
    9029042
    Category:
    Etchers / Ashers
    RIE plasma system | | Includes: | Balzers / Pfeiffer TPH pump | Balzers/ Pfeiffer TCP 380 pump controller | ENI ACG-10B RF generator | ENI ACG-3 RF generator | LYTRON RC recirculating chiller | Inficon IG3 vacuum gauge | Circuit breaker / isolation box | RackMount PC with STS software installed.
  • STS: MESC Multiplex

    Details
    ID#:
    171063
    Category:
    Etchers / Ashers
    ICP etcher, 4" | Can be converted to 6" or 8" | Configured for ASE (Advanced Silicon Etch) | Plumbed with O2, Ar, C4F8, and SF6 | | Specifications: | Process: Silicon etching | Mechanical Wafer Clamping | He Backside Cooling | Multiplex ICP SC160M Process Chamber (MESC) | E-Rack Electronics Modules | Dry Pump: Edwards QDP80 | Loadlock pump Edwards EM40 | Chiller: Chiller | Turbo Pump: Leybold MAG900CT | Gas C4F8 SF6 O2 Ar N2 | Electrode Temperature Control (+5 to + 40°C) | 300/30W (13.56MHz) RF Supply and Matching Unit | 1kW (13.56MHz) RF Supply and Matching Unit | Loadlock Adaptor: MMPlex Carousel | MKS 600 | Software version Dos6.22 | AOE | | Manuals included | 1998 vintage.
  • STS: Multiplex

    Details
    ID#:
    152796
    Category:
    Etchers / Ashers
    Wafer Size:
    8" 
    Vintage:
    2000 
    Aspect DRIE cluster tool, 8" | Configured for bosch process | Dual chambers are identical | | C4F8 400 sccm | SF6 600 sccm | O2 100 sccm | Ar 50 sccm | CF4 50 sccm | CHF3 100 sccm | HBr 200 sccm | BCl3 100 sccm | Cl2 200 sccm | He 100 sccm | N2 100 sccm | N2 200 sccm | | Deinstalled and currently in storage | 2000 vintage.
  • STS: Multiplex

    Details
    ID#:
    156263
    Category:
    Etchers / Ashers
    Wafer Size:
    2" 
    Vintage:
    1998 
    ICP etcher, 2" | Wafer size can be changed | PC (Windows) driven user friendly operator interface | Loadlock chamber with cassette | Central handling chamber | Etching chamber | He backside cooling | End point detector | RF Generator: 1000 Watts | Gases used: CI2, N2, O2, Ar, He, HBR | (3) EDWARDS pumps for load lock, handling chamber and etch chamber | 1998 vintage.
  • STS: MESC Multiplex

    Details
    ID#:
    9004366
    Category:
    Etchers / Ashers
    Vintage:
    2001 
    Standard RIE etcher, 6" | Intellimetrics end-point detector | ENI ACG3G 300/30 watt (13.56 MHz) RF power supply & matching network | Non-clamp system with DI water cooled chuck (+5 to -40 degrees C) | Load lock | Wafer loader (MAC) | Remote gas box (O2, Ar, CF4, CHF3) | Pfeiffer TH521 PC turbo | Betta-tech chiller | 2001 vintage.
  • STS: ASE

    Details
    ID#:
    9004367
    Category:
    Etchers / Ashers
    Vintage:
    2000 
    ICP Advanced Silicon Etch system | He backside cooling | 6" clamp configuration | ENI 300/30 Watt (13.56MHz) RF power supply | Advanced Energy 3kWatt matching network | Leybold Mag200CT | Huber 140W chiller | OnBoard gas panel- 4 MFCs (SF6, O2, Ar, C4H8) | 6" clamp chuck | Edwards iQMB250 / iQDP80(M) | MAC Cassette to Cassette Loader can be an option | 2000 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    184340
    Category:
    Etchers / Ashers
    Vintage:
    1997 
    Cluster etcher | ICP Etch/One chamber Poly / Oxide | One transfer chamber | One vacuum cassette loadlock | (Qty 2) Process kit | Manometer: Leybold 100 mPa / MKS 10 mBar | Turbo pump: TMH100 | ESC chuck | RF Gen Source: ENI (ACG-10B) Bias: ENI (ACG-10B) | RF Match: Auto match | Transfer: Cluster (Dealer) | Load lock: Vacuum Cassette Elevator Remote | Gasbox MFC N2/200, O2/50, N2/50, N2/100, N2/300, N2/100, N2/50, N2/50 | Process gas: SF6/O2/Ar/CF4/C3F8/CHF3/Cl2/C2H4 | EBARA 40X20 Dry Pump Package dry pump | EBARA 50X20 Dry Pump Package dry pump | Neslab Ult-90 chiller | System is currently installed | 1997 vintage.
  • STS: ASE

    Details
    ID#:
    9004369
    Category:
    Etchers / Ashers
    Wafer Size:
    8" 
    ICP Advanced Silicon Etch system, 8" | Manual load | Single wafer load lock | Standard rate ASE | 6" wafer configuration | Pfeiffer TMH 100PC turbo pump with TCP 600 controller | RF trolley | ENI ACG3 - 300W RF power supply for lower electrode | ENI ACG10B - 1000W RF power supply for upper electrode | Matchworks and tunner for each | Remote gas box with (4) MFCs (Ar,O2, SF6, C4F8) | 208V.
  • STS: Multiplex

    Details
    ID#:
    181325
    Category:
    Etchers / Ashers
    Reactive Ion Etchers.
  • STS: Multiplex

    Details
    ID#:
    9008189
    Category:
    Etchers / Ashers
    Wafer Size:
    6" 
    PECVD system, 6" | Spare plate for 3" | SiH4, NH3, N20 | L / L | Auto load | RF gen ACG3 | Chiller bettatech | No pumps | Unclamped or ESC.
  • STS: Multiplex

    Details
    ID#:
    192919
    Category:
    Etchers / Ashers
    AOE Chamber | Mechanically clamped.
  • STS: Multiplex ICP

    Details
    ID#:
    9012722
    Category:
    Etchers / Ashers
    Etcher, 6"-8" | 6" mechanic clamping | 380 voltage | Brooks handling system | Brooks cassette | Windows 2000 | End point detection | Generators | 1998 vintage.
  • STS: Multiplex

    Details
    ID#:
    161334
    Category:
    Etchers / Ashers
    Reactive Ion Etcher | Manually loaded load-lock batch plasma etch system | The wafer platen can accommodate a variety of substrate sizes from 75 mm up to 200 mm | The process chamber is configured for reactive ion etching | Process gas is introduced to the process chamber through a showerhead located above platen | Temperature control of the substrate platen is achieved using a recirculating liquid system | PC controller provides fully automatic and user friendly operation | Turbo pumped chamber with roughing pump | Five gas inputs | Last gas used: N2, O2, He, SF6, SiCL4 | Balzers TPH240IS turbopump with a TCP380 controller | This system has no top source; RF energy is supplied to the platen on which the substrates rest | ENI ACG-6 13.56 MHz 600 W RF Generator | 208V, 3 Ph, 60 Hz.
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