STS MULTIPLEX ASE HRM Products

  • STS: Multiplex ASE ICP

    Details
    ID#:
    9032748
    Category:
    Etchers / Ashers
    Etcher, 6" | Manually load system with Load Lock | Clamp style (2 " to 8" capable) | Leybold MagLev pump | ENI RF power supples with Match work and tuners | Onboard Mini-Box GasBox, 4 line (includes 3 MFCs - SF6 300sccm; O2 100sccm; Ar 50sccm) | Chamber pump: Edwards iQDP80 | Loadlock pump: Edwards iQDP40 | 208 VAC | 2000 vintage.
  • STS: ICP ASE

    Details
    ID#:
    166201
    Category:
    Etchers / Ashers
    Silicon Plasma Etch System, 6" | Currently configured for 6" wafers, capable up to 8" wafers | Manual load | Single wafer load lock | Standard rate ASE | Turbo pump: Pfeiffer TMH 100PC with TCP 600 controller | RF trolley | RF power supply: lower electrode ENI ACG-300W, upper electrode ENI ACG10B-1000W; both with matchworks and tuner | | Remote gas box: | (4) MFC's: | Ar | O2 | SF6 | C4F8 | | RF Generator: ENI ACG-1087 | Phase Shift Generator: Vl-400 | Cluster Multiplex PPD | 208V.
  • STS: MESC Multiplex

    Details
    ID#:
    171063
    Category:
    Etchers / Ashers
    ICP etcher, 4" | Can be converted to 6" or 8" | Configured for ASE (Advanced Silicon Etch) | Plumbed with O2, Ar, C4F8, and SF6 | | Specifications: | Process: Silicon etching | Mechanical Wafer Clamping | He Backside Cooling | Multiplex ICP SC160M Process Chamber (MESC) | E-Rack Electronics Modules | Dry Pump: Edwards QDP80 | Loadlock pump Edwards EM40 | Chiller: Chiller | Turbo Pump: Leybold MAG900CT | Gas C4F8 SF6 O2 Ar N2 | Electrode Temperature Control (+5 to + 40°C) | 300/30W (13.56MHz) RF Supply and Matching Unit | 1kW (13.56MHz) RF Supply and Matching Unit | Loadlock Adaptor: MMPlex Carousel | MKS 600 | Software version Dos6.22 | AOE | | Manuals included | 1998 vintage.
  • STS: MXP Multiplex

    Details
    ID#:
    9005443
    Category:
    Etchers / Ashers
    ICP ASE HR Silicon Etch Bosch Process System, 6" | Capable of 2"-8" | | Loadlock | Loadlock pump: Edwards E2M40 | | High Vacuum Pump Pfeiffer MAG 2000 | Roughing Pump Edwards IQMB250 & IQDP80 | RF Generator Model ENI/ACG-3B and Advanced Energy RFG 3001 | Number of Gas Inputs Four Gas | Process Gases SF6, C4F8, O2, Ar | | Chillers | Number of Chillers 1 | Chiller #1Manufacturer/Model Huber/Unistat 140W | | Accessories: | ICP V2 - Balun coil | Mechanical Clamp | Helium Backside Cooling | Carousel in MkIV MPX - 2 x 150mm wafers | 3KW Source | 300/30W platen | E-Rack Modules: HCL1 +HCU3 +HCU5+VAC3Y +2x AMC1 +HBC2 | | Windows 2000 | Bosch license | Current Power Requirements: 400V , 50Hz, 40 Amp, 3 phase | Unit can be configured for: 208/460, 60 Hz, 3 Phase | CE Marked | 2003 vintage.
  • STS: Multiplex

    Details
    ID#:
    9021351
    Category:
    Etchers / Ashers
    Wafer Size:
    2"-8" 
    Vintage:
    1999 
    ASE AOE ICP cluster tool, 2"-8" | Set wafer size: 6" | Process capabilities: silicon and oxide etch | | Chamber 1 description: | Vacuum system: | Edwards model QDP80 vacuum pump | Edwards model QMB250F mechanical booster pump | Leybold model Mag W 2000 CT turbomolecular pump | Gas inputs: Eleven Tylan model FC2900M MFCs | | Chamber 2 description: | Vacuum system: | Edwards model QDP80 vacuum pump | Edwards model QMB250F mechanical booster pump | Leybold model Mag W 2000 CT turbomolecular pump | Gas inputs: Eleven Tylan model FC2900M MFCs | | Controller type: PC | Software revision level: version 8 | Elevator type: Brooks Automation | Process gases: C4F8, SF6,O2,Ar, C3F8, CF4, Cl2, BCl3, HBr, N2 | External cooling: water cooled | | ICP controller 1: | Leybold model Mag Drive 2000 electronic frequency converter | Vat model PM7 adaptive pressure controller | | ICP controller 2: | Leybold model Mag Drive 2000 electronic frequency converter | Vat model PM7 adaptive pressure controller | | Dealer robot: Brooks Automation model 001-7500-02 | | Vacuum cassette load lock handler: | (1) Brooks Automation model 001-9300-57 | Load lock pump: Edwards QDP40 vacuum pump | | Generator rack: | Advanced Energy model LF-5 RF generator | (2) Advanced Energy model RFG 3001 generator | (2) ENI model ACG-3B RF generator | | (2) Taitec Corporation model UC-70 recirculator/chiller | | Power requirements: | 208 V, 3 phase, 60 Hz | | 1999 vintage.
  • STS: ASE

    Details
    ID#:
    201044
    Category:
    Etchers / Ashers
    Vintage:
    1999 
    ICP system | Brooks cluster vacuum substrate handler | | Multiplex ASE ICP process module: | Low pressure plasma processing chamber | Inductive coupled high frequency source 3 kW (13.56 MHz) RF matching network | 300/30W (13.56 MHz) RF supply and matching network | Phase lock unit for (2) 13.56 MHz P.S. | Temperature controlled (-40C to -45C) | Substrate susceptor | Mechanical wafer clamping with backside cooling (8" configuration) | Gas lines: SF6, C4F8, O2, Ar, CF4, CHF3, HBr | Deep silicon trench process package | | Includes Edwards QDP40 dry pump, Edwards QDP 40/QDP 250 blower, manuals | 1999 vintage.
  • STS: Multiplex 320

    Details
    ID#:
    104659
    Category:
    Etchers / Ashers
    Wafer Size:
    2" - 8" 
    RIE system | Manual load-lock batch plasma etch system | The wafer platen can accommodate a variety of substrate sizes from 2" up to 8" | | The process chamber is configured for sputter and/or reactive etching of a large range of materials including: | Metals | Dielectrics | Photoresist | Many Inorganic and Organic substances | | The plasma is produced via the matching unit into an alumina chamber | This provides a high density plasma capable of operating in a very wide process range | Independent energy control is provided by 13.56 MHz Freq biasing of the substrate platen via automatic power control and impedance matching | System is designed for maximum process flexibility and reproducibility | Process gas is introduced to the process chamber through a showerhead arrangement, which is located in the upper cover assembly | The substrates are placed on the electrode assembly which is powered at 13.56 MHz | Temperature control of the substrate platen which is required for certain processes is achieved using a recirculating liquid system | Unit chamber has been designed to the highest vacuum engineering standards with the number of components kept to a minimum, with particular consideration given to the elimination of virtual leaks | This results in a very stable chamber environment leading to processes of the highest quality | The aluminium load-lock has a transparent hinged lid which allows easy access for loading/unloading of the wafer carrier | After loading of the wafer into the load-lock, the system automatically carries out pumpdown, leak check and transfer of the wafer into the process chamber via the carriage assembly, after which the process will be started | The MULTIPLEX RIE control is via an Industry standard Personal computer. A color monitor displays process information and mimic displays, allowing the system to be operated and continuously monitored | Process recipes are downloaded to hard or floppy disk | The system is run in automatic mode | In the event of system external service malfunction, one of the comprehensive set of diagnostic legends is displayed, and the machine is automatically placed in a safe condition | The system footprint may be minimized by remoting the sealed extracted gas cabinet from the etch console | Access to the system is provided at the rear and side of the machine allowing unimpeded maintenance access to all major components | Various pumping combinations may be connected to the high conductance pumping lines, depending on process requirements.
  • STS: Multiplex

    Details
    ID#:
    9029042
    Category:
    Etchers / Ashers
    RIE plasma system | | Includes: | Balzers / Pfeiffer TPH pump | Balzers/ Pfeiffer TCP 380 pump controller | ENI ACG-10B RF generator | ENI ACG-3 RF generator | LYTRON RC recirculating chiller | Inficon IG3 vacuum gauge | Circuit breaker / isolation box | RackMount PC with STS software installed.
  • STS: Multiplex

    Details
    ID#:
    181325
    Category:
    Etchers / Ashers
    Reactive Ion Etchers.
  • STS: Multiplex

    Details
    ID#:
    192919
    Category:
    Etchers / Ashers
    AOE Chamber | Mechanically clamped.
  • STS: Multiplex

    Details
    ID#:
    9071736
    Category:
    Reactors
    PECVD System, 3" to 8" | Currently configured for 6" | Currently depositing: SiO2, Si3N4 | 6" Wafer carrier for pieces up to 4" | AE low RF and high RF generator | (1) SMC chiller for the shower head | (2) Pumps: (1) single vane pump for loadlock; (1) pump/blower package for chamber | | Gas lines: | 2%SiH4 in N2 | N2O | NH3 | N2 | | Cleaning gases: | O2 | CF4 | | ~1997 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    187772
    Category:
    Etchers / Ashers
    Wafer Size:
    4", 6", 8" 
    Vintage:
    2005 
    Etcher, 8" | | Specifications: | Wafer size: Adjustable to 4", 6", 8" | (4-5) gas lines | Mechanical Weighted Clamp | He Backside Cooling | Multiplex ICP SC160M Process Chamber (MESC) | E-Rack Electronics Modules | Loadlock: Single Slice Loadlock Chamber | Dry Pump: Edwards IH80 | Chiller: Affinity RWA-012 Chiller | Turbo Pump: Osaka TG1133EMBW-95 | Coil RF Generator: ENI ACG-3B | Platen RF Generator: ENI ACG-10B | All Cables, Applicable Spares and Accessories will be included | | Stored in clean room, powered off | Can be inspected | 2005 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    184340
    Category:
    Etchers / Ashers
    Vintage:
    1997 
    Cluster etcher | ICP Etch/One chamber Poly / Oxide | (1) Transfer chamber | (1) Vacuum cassette loadlock | (2) Process kits | Manometer: Leybold 100 mPa / MKS 10 mBar | Turbo pump: TMH100 | ESC chuck | RF Gen Source: ENI (ACG-10B) Bias: ENI (ACG-10B) | RF Match: Auto match | Transfer: Cluster (Dealer) | Load lock: Vacuum Cassette Elevator Remote | EBARA 40X20 Dry Pump Package dry pump | EBARA 50X20 Dry Pump Package dry pump | Chiller: Neslab Ult-90 | | Process gases: SF6/O2/Ar/CF4/C3F8/CHF3/Cl2/C2H4 | Gasbox MFC: | N2/200 | O2/50 | N2/50 | N2/100 | N2/300 | N2/100 | N2/50 | N2/50 | | Currently warehoused | 1997 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    9027922
    Category:
    Etchers / Ashers
    Etching system.
  • STS: Multiplex

    Details
    ID#:
    180482
    Category:
    Etchers / Ashers
    ICP Etcher | Chiller and pumps not included.
  • STS: Multiplex

    Details
    ID#:
    156263
    Category:
    Etchers / Ashers
    Wafer Size:
    2" 
    Vintage:
    1998 
    ICP etcher, 2" | Wafer size can be changed | PC (Windows) driven user friendly operator interface | Loadlock chamber with cassette | Central handling chamber | Etching chamber | He backside cooling | End point detector | RF Generator: 1000 Watts | Gases used: CI2, N2, O2, Ar, He, HBR | (3) EDWARDS pumps for load lock, handling chamber and etch chamber | Currently stored in cleanroom | 1998 vintage.
  • STS: MESC Multiplex

    Details
    ID#:
    9004366
    Category:
    Etchers / Ashers
    Vintage:
    2001 
    Standard RIE etcher, 6" | Intellimetrics end-point detector | ENI ACG3G 300/30 watt (13.56 MHz) RF power supply & matching network | Non-clamp system with DI water cooled chuck (+5 to -40 degrees C) | Load lock | Wafer loader (MAC) | Remote gas box (O2, Ar, CF4, CHF3) | Pfeiffer TH521 PC turbo | Betta-tech chiller | 2001 vintage.
  • STS: Multiplex

    Details
    ID#:
    152796
    Category:
    Etchers / Ashers
    Wafer Size:
    8" 
    Vintage:
    2000 
    Aspect DRIE cluster tool, 8" | Configured for bosch process | Dual chambers are identical | | C4F8 400 sccm | SF6 600 sccm | O2 100 sccm | Ar 50 sccm | CF4 50 sccm | CHF3 100 sccm | HBr 200 sccm | BCl3 100 sccm | Cl2 200 sccm | He 100 sccm | N2 100 sccm | N2 200 sccm | | Deinstalled and currently in storage | 2000 vintage.
  • STS: Multiplex

    Details
    ID#:
    9061917
    Category:
    Etchers / Ashers
    Wafer Size:
    4" 
    Vintage:
    2002 
    ICP AOE System, 4", 2002 vintage.
  • STS: Multiplex ICP

    Details
    ID#:
    9058502
    Category:
    Etchers / Ashers
    System, 8" | Wafer type: flat | Carousel vacuum loadlock with (1) ICP SR process chamber | Platform MPX | Module ICP | Installation Ballroom | Voltage 208V | Pumps not Included | EPD: no EPD ­ | Clamp WTC | Lower Electrode PSU NO LF | Intellemetrics Endpoint Detection System | Weighted Clamping System conversion for 4”, 6” and square substrates using 8" inserts - No reconfiguration of the ICP chamber is required | | Gas Box: | C4F8 400 sccm | O2 100 sccm | Ar 50 sccm | SF6 600 sccm | | Multiplex ICP-M (Mechanically Clamped) Process Module Details: | ICP Source (exc. PSU and Matching) | 5500 Watt (13.56 MHz) ENI GHW-50A RF Supply and Matching Unit (for ICP Source) | 300/30 Watt (13.56 MHz) ENI ACG-3B-01 RF Supply and Matching Unit (for lower electrode) | Electrode Temperature Control (+5 to +40deg C) | Mechanical Wafer Clamping Electrode (pin lift) with He Backside cooling | Leybold MAG2000CT Turbo Pump | Windows Software Control | Standalone VDU, keyboard and mouse | 2000 vintage.
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